• 3.8 Introduction of Term Project: BT Light (Chinese Style)

    • A. Learning Objectives

      • Apply a wide range of materials (e.g. card board, medium density fibreboard (MDF), high density foam board (HDFB), acrylic, and common alloys) and techniques (e.g. surface development, mock-up fabrication, and prototyping) appropriate to modelling and prototyping (e.g. architectural and product design) 
        [from HKDSE DAT curriculum: Module 5 Visualisation and Computer-aided Design (CAD) Modelling]

    • B. Note

      B1. Design Thinking

      Design thinking       is a non-linear, iterative process that teams use to understand users, challenge assumptions, redefine problems and create innovative solutions to prototype and test. Involving five phases—Empathize, Define, Ideate, Prototype and Test—it is most useful to tackle problems that are ill-defined or unknown.



      B2. Modular Design

      Modular design (or modularity) is an approach used to design various products or applications – by breaking them down into separate or independent parts. These individual parts (for example, a laptop battery) can then be used for the same functionality in different systems or products.



      B3. Other factors to consider

      Example: Design a Commemorative Stationery Organiser (Source: EDB)


      The following questions should be considered in designing and making the commemorative stationery organiser:
      1. What is the shape of the base?
      2. What stationery will be used? How to keep it?
      3. What notepaper will be used? How to keep it?
      4. What are the properties of the materials provided?
      5. How to use the materials provided properly?
      6. What method to be used to make the units for keeping the stationery and notepaper?
      7. What additional devices/functions can be added? 
      8. What method to be used to join the base and each of the units?
      9. How to easily get the stationery and notepaper?
      10. What method to be used for surface finishing?
      11. ...

    • B4. Special Design Software for Laser Cutting

      Makercase:




      Boxes.py:


    • C. Material List

      Items Qty Size Cost Ref.
      MCU board (CPU: ESP32)  1 52 mmL x 29 mmW x 25 mmH (including Dupont wire end)      
      LED matrix 8x8 (controller: WB2812)  1 80 mmL x 80 mmW x 3.5mH
      66 mmL x 68 mmW x 3 mmH
      		    
      MDF  1 A4 x 3mm thick    
      Acrylic sheet   1 A4 x 3mm thick     

      Box Inner Dimensions: 80mmL x 80mmL x (25+3.5)mmH
      Box Inner Dimensions: 66mmL x 68mmW x (25+3)mmH
      Thickness: 3mm
      Edge Joint:  Finger (Finger Size: 12mm)

      Remark:
      1. Class / Class No. Name
      2. A hole for USB cable (12 x 8 mm)

    • D. Examples









    • Small Box (DXF) 文件

      Inner size: 66 x 68 x 28H mm
      Thinkness of board: 3mm
      Finger Joint: 12mm
      Hole for USB: 8 x 12mm